PulseForge and Applied Novel Devices Collaborate to Showcase Breakthrough in Photonic Debonding for Advanced Power Electronics Packaging. AUSTIN, TEXAS, USA, August ...

FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product ...

Power electronics in the Industry 4.0 era are evolving to deliver higher efficiency and power density and simplify power design.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

When the word "semiconductor" is used in a sentence, most people think of the chip itself—the tiny piece of silicon etched ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Written by Dr. Pradyumna (Prady) Gupta, Founder & CEO of Infinita Lab and Infinita Materials. As electronic devices and EV systems continue to push the boundaries of power density and miniaturization, ...

Power density plays a critical role in making power electronic systems smaller, more efficient, and more cost-effective. As power density increases, so does the heat generated inside a device.