Yahoo Finance

Cadence SiP Technologies and Allegro Package Designer Optimized for Hand-Held Consumer Electronics Market

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...
it.tmcnet

Cadence Unveils Enhanced Allegro Package Designer, SiP Layout

Cadence Design Systems (News - Alert), Inc. has unveiled an enhanced version of its Allegro 16.6 Package Designer and System-in-Package offering. Discreet IC package necessities for next-generation ...
EDN

Cadence Allegro platform delivers high-speed interconnect design

San Jose, Calif. — Cadence Design Systems, Inc. has released its Cadence Allegro system interconnect design platform to optimize and accelerate high-performance, high-density interconnect designs. The ...
Design-Reuse

New Cadence Virtuoso System Design Platform Provides Seamless Design Flow Between IC, Package and Board

Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif. , May. 30, ...
EDN

Extraction tool for package designs integrated with Allegro

SAN FRANCISCO — Fluent Inc. has released the latest version of its Icemax circuit extraction tool for advanced IC package designs. According to Fluent (Austin, Texas), Icemax 2.1 is a major update to ...
Semiconductor Engineering

Demystifying Mirror Types

I’m not talking about carnival funhouse mirrors, but rather the different options for mirroring symbols, vias, and bond fingers in your IC Package layout. The Allegro Package Designer Plus and SiP ...