In addition to everything in the Wafer Cleaving Kit (CSK-200M-LG), The Cleaving Station includes a 12” x 18” self-healing cutting mat, two diamond scribes for marking and scribing, one pen style ...
The “Scribing and Cleaving Kit for Small Samples” includes a clear ruler with metric and imperial/US units, a fine tipped sharpie for marking the sample, sample handling tweezers, a pen style diamond ...
LatticeGear has developed the FlipScribe and LatticeAx cleaving machines for preparing samples with sizes down to 1 mm. In the first step of the process, the cross-section face of the thin sample is ...
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