Q: You have often written about the legal problems arising in the course of the host-IC relationship. If our agency were to design a hosting program and IC contract from scratch, what terms and ...

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This ...

ANAHEIM, Calif. — At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised ...

The power-performance-area (PPA) metric and time-to-market of modern system-on-chips (SoCs) are dominated by two major issues: on-chip interconnects and layout parasitics. Especially, as the industry ...