VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

Sensitive electronic components such as battery packs, micro-switches, solenoids, sensors, connectors and wire harnesses employed in the automotive and electronics sectors more often than not need to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Master Bond Inc offers the widest selection of compounds and the technical expertise to help you meet your potting and encapsulation needs. From relays, connectors and power supplies to surge ...

Mold-encapsulated glass for automotive applications based on a polyurethane (PUR) flush sealing technique is less prone to breakage than conventional processes, according to BBG GmbH, a mold maker and ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...