Researchers developed a new chip stacking method that could quadruple AI memory density, potentially solving one of the ...

Researchers have found a way to build a three-layered silicon chip without the chip overheating.

Researchers can now fabricate a 3D chip with alternating layers of semiconducting material grown directly on top of each other. The method eliminates thick silicon substrates between the layers, ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

GPUs and other big AI chips just can’t get enough memory. Today’s data center computers stack DRAM 12 dies high. But as memory makers try to build higher stacks to pack in more bits and bandwidth, ...

IBM just unveiled the world's first sub 1-nanometer chip: 100 billion transistors. IBM also says they've produced functioning devices with this technology.

Forward-looking: For years, the chip industry has chased better performance by shrinking transistors and squeezing more of them onto a flat slice of silicon. That strategy is running into hard limits.

Shares fell 6.7% in early afternoon European trading, but remained up over 90% so far this year.