Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...
Efficient management and exploitation of thermal energy is key for many engineering applications. Greater understanding and control of thermal processes, such as thermal energy harvesting, storage and ...
TROY -- Altair's HyperWorks Partner Alliance announced the expansion of its partnership with TES International. TES has added its thermal and fluid flow analysis software, ThermoFlo, to the HWPA's ...
In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...
Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...
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