Cleaving is a simple yet rapid method used to prepare samples of silicon and other semiconductor materials; however, despite being a single crystal material, sapphire does not cleave well. Existing ...
This article shows how to prepare samples and downsize wafers in the cleanroom, without compromising the cleanliness of the wafers or cleanroom. In this article, the LatticeAx 420 scribeless cleaving ...
The elimination of sawing kerf loss combined with its ability to make thinner wafers of high quality make the implant-cleave wafering approach technically and economically attractive. For example, ...
The SiGen NanoTec layer transfer tools and processes are built around two key process requirements: (1) strong atomic layer bonding of semiconductor wafers using SiGen Plasma Activation Technology and ...
First, it is used for downsizing the bare 2” or 3” wafer prior to fabrication of the nanostructures. Cleaving of the wafers is carried out along the crystallographic direction. Then, each wafer is ...
Starting with a whole wafer, this instructional video shows you how to downsize a wafer into die sized pieces. The process results in high quality, clean samples that can be used for further analysis.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results